To compete with Samsung and Apple, Huawei will soon be releasing its new smartphone. The Chinese multinational technology and equipment manufacturer has reportedly started distributing invites for its October 16 launch event, which will be held in Munich, Germany. According to Gadgets NDTV, the event only points out to the unveiling of Huawei’s new flagship device – the Huawei Mate 10.

Specs, price and features

Though the invite does not reveal much detail about Huawei Mate 9’s successor, aside from the tagline “Meet the device worth waiting for” with a shadow of numeral 10, there were images that appeared online seemingly pointing out to be the much-awaited Huawei device.

If the images were indeed the Mate 10, the device may come in a metal unibody and a 6.1” Quad HD bezel-less display. It can be recalled that Huawei’s CEO Richard Yu confirmed in July that their upcoming flagship will be equipped with a bezel-less display, known as EntireView. According to the same publication, the move to have this kind of display was said to compete with Apple’s upcoming flagship - the iPhone 8.

Meanwhile, as seen on the leaked front and rear renders of the Mate 10, the device houses a dual Leica rear camera and a fingerprint sensor just below it, which was initially rumored to be placed beneath the device’s display.

Aside from the specs mentioned above, rumor has it that the device may sport facial recognition, 3D sensors, an iris scanner, 2K resolution and may possibly be compatible with Augmented Reality.

In addition, there’s a possibility that Mate 10 would be available in two RAM variants – 6 GB RAM variant and 8 GB RAM variant – and may house the latest Android 8 on top of its own UI. The smartphone will also reportedly powered by a 4,000 mAh battery and may have a debut price of CNY 4,000 (approximately $600 based on the current exchange rate).

Huawei’s own SoC leaked online

Shortly after the confirmation that Huawei’s own HiSilicon Kirin 970 already entered into mass production, its specs have now been plaguing online. Thanks to a Weibo user, the public now knows the exact specification of Huawei’s new 10nm chip, which is said to be featured in the company’s upcoming smartphone flagship.

Based on the leaked specs of Kirin 970, the SoC will house an ARM 64bit octa-core central processing unit. It will sport four Cortex-A73 at 2.8 GHz, four Cortex-A53 in an unknown clocked speed, and an LPDDR4 memory. Its memory can reach up to 1866 MHz frequency while its GPU will feature Mali-G72 MP8.

According to the leaked specs sheet, HiSilicon Kirin 970 with TSMC’s 10nm process will support Bluetooth 4.2, Cat.12 protocol and Wi-Fi 802.11 connectivity, just to name a few.